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WED3C7410E16M-400BX Datasheet PDF - White Electronic Designs Corporation

Part NameDescriptionManufacturer
WED3C7410E16M-400BX RISC Microprocessor Multichip Package WEDC
White Electronic Designs Corporation WEDC
Other PDF  no available.
WED3C7410E16M-400BX Datasheet PDF : PDF DOWNLOAD   
WED3C7410E16M-400BX image

OVERVIEW
The WEDC 7410E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and dynamic power management.

The WED3C7410E16M-400BX multichip package consists of:
• 7410E AltiVec RISC processor
• Dedicated 2MB SSRAM L2 cache, configured as 256Kx72
• 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)
• Maximum Core frequency = 400MHz @ 1.8V
• Maximum L2 Cache frequency = 200MHz
• Maximum 60x Bus frequency = 100MHz

FEATURES
■ Footprint compatible with WED3C7558M-XBX and WED3C750A8M-200BX
■ Implementation of Altivec technology instruction set
■ Optional, high-bandwidth MPX bus interface

 

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