General Description
Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ2552P minimizes both PCB space and RDS(ON). This dual BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultr alow profile packaging, low gate charge, and low RDS(ON).
Features
• –6 A, –20 V. RDS(ON) = 0.045 Ω @ VGS = –4.5 V RDS(ON) = 0.075 Ω @ VGS = –2.5 V.
• Occupies only 0.10 cm2 of PCB area. 1/3 the area of SO-8.
• Ultra-thin package: less than 0.70 mm height when mounted to PCB.
• Outstanding thermal transfer characteristics: significantly better than SO-8.
• Ultra-low Qg x RDS(ON) figure-of-merit.
• High power and current handling capability.
Applications
• Battery management
• Load switch
• Battery protection
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