FEATURES
- Glass passivated junction chip
- Ideal for automated placement
- Low profile package
- Low power loss, high efficiency
- Halogen-free according to IEC 61249-2-21
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC

MECHANICALW DATA
Case: SOD-123FL
Molding compound, UL flammability classification rating 94V-0
Moisture sensitivity level: level 1, per J-STD-020
Packing code with suffix "G" means green compound (halogen-free)
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
Polarity: Indicated by cathode band
Weight: 0.016 g (approximately)