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KA7777T[hybrid IC]

other part :KA7777D   SC7777D   SC7777T  

• Adjustment processes are decreased
   by function and ratio trimmings
• High density mounting by bonding (COB)
• Various types of package are available
• High reliability achieved by KOA’s original thick
   film technology
• Thick film printed circuit substrate applies the non-noble
   metal paste (conductive paste and resistive paste) and
   receives the many total inquires including material
   selecting, pattern designing and mass production

KOA Speer Electronics, Inc.

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