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SN74ABT534A

  

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SN74ABT534A[OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS]

other part :AB534A   ABT534A   SN54ABT534   SNJ54ABT534W   SN74ABT534AN   SNJ54ABT534J   SN74ABT534ADW  

description
These 8-bit flip-flops with 3-state outputs are designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

● State-of-the-Art EPIC-ΙΙB™ BiCMOS Design Significantly Reduces Power Dissipation
● Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
● Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
● High-Drive Outputs (–32-mA IOH, 64-mA IOL)
● ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
● Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package

Texas Instruments
Texas-Instruments

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SN74ABT534AN[OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS]

other part :AB534A   ABT534A   SN54ABT534   SN74ABT534A   SNJ54ABT534J   SNJ54ABT534W   SN74ABT534ADW  

description
These 8-bit flip-flops with 3-state outputs are designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

● State-of-the-Art EPIC-ΙΙB™ BiCMOS Design Significantly Reduces Power Dissipation
● Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
● Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
● High-Drive Outputs (–32-mA IOH, 64-mA IOL)
● ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
● Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package

Texas Instruments
Texas-Instruments

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SN74ABT534ADW[OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS]

other part :AB534A   ABT534A   SN54ABT534   SN74ABT534A   SNJ54ABT534W   SN74ABT534AN   SNJ54ABT534J  

description
These 8-bit flip-flops with 3-state outputs are designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

● State-of-the-Art EPIC-ΙΙB™ BiCMOS Design Significantly Reduces Power Dissipation
● Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
● Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
● High-Drive Outputs (–32-mA IOH, 64-mA IOL)
● ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
● Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package

Texas Instruments
Texas-Instruments

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SN74ABT534ADBR[OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS]

other part :AB534A   ABT534A   SN54ABT534   SN74ABT534A   SNJ54ABT534W   SN74ABT534AN   SNJ54ABT534J  

description
These 8-bit flip-flops with 3-state outputs are designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

● State-of-the-Art EPIC-ΙΙB™ BiCMOS Design Significantly Reduces Power Dissipation
● Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
● Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
● High-Drive Outputs (–32-mA IOH, 64-mA IOL)
● ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
● Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package

Texas Instruments
Texas-Instruments

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SN74ABT534ADWR[OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS]

other part :AB534A   ABT534A   SN54ABT534   SN74ABT534A   SNJ54ABT534W   SN74ABT534AN   SNJ54ABT534J  

description
These 8-bit flip-flops with 3-state outputs are designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

● State-of-the-Art EPIC-ΙΙB™ BiCMOS Design Significantly Reduces Power Dissipation
● Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
● Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
● High-Drive Outputs (–32-mA IOH, 64-mA IOL)
● ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
● Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package

Texas Instruments
Texas-Instruments

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SN74ABT534ANE4[OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS]

other part :AB534A   ABT534A   SN54ABT534   SN74ABT534A   SNJ54ABT534W   SN74ABT534AN   SNJ54ABT534J  

description
These 8-bit flip-flops with 3-state outputs are designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

● State-of-the-Art EPIC-ΙΙB™ BiCMOS Design Significantly Reduces Power Dissipation
● Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
● Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
● High-Drive Outputs (–32-mA IOH, 64-mA IOL)
● ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
● Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package

Texas Instruments
Texas-Instruments

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SN74ABT534APWE4[OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS]

other part :SN74ABT534APWG4  

description
These 8-bit flip-flops with 3-state outputs are designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

● State-of-the-Art EPIC-ΙΙB™ BiCMOS Design Significantly Reduces Power Dissipation
● Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
● Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
● High-Drive Outputs (–32-mA IOH, 64-mA IOL)
● ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
● Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package

Texas Instruments
TI

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SN74ABT534APWG4[OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS]

other part :SN74ABT534APWE4  

description
These 8-bit flip-flops with 3-state outputs are designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

● State-of-the-Art EPIC-ΙΙB™ BiCMOS Design Significantly Reduces Power Dissipation
● Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
● Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
● High-Drive Outputs (–32-mA IOH, 64-mA IOL)
● ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
● Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package

Texas Instruments
TI

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