The manufacturing process of Smartcards involves various components and technologies in order to issue a finished product:
– flat packages,
Dedicated package for Smartcard products, the micromodule type depends on the size of the product and on the application.
Table 1 lists all available micromodules.
■ FLAT PACKAGES
For applications which require surface mount technology, suitable for PC cards, or other security modules, STMicroelectronics offers flat packages listed In Table 2.
For issuer production need, ST offers sawn and unsawn wafers deliveries, listed in Table 3.