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WED3C755E8M-XBX Datasheet PDF - White Electronic Designs Corporation

Part NameDescriptionManufacturer
WED3C755E8M-XBX RISC MICROPROCESSOR MULTI-CHIP PACKAGE WEDC
White Electronic Designs Corporation WEDC
Other PDF  no available.
WED3C755E8M-XBX Datasheet PDF : PDF DOWNLOAD   
WED3C755E8M-XBX image

OVERVIEW
The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and dynamic power management. The WED3C755E8M-XBX multichip package consists of:

■ 755 RISC processor (E die revision)
■ Dedicated 1MB SSRAM L2 cache, confi gured as 128Kx72
■ 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)
■ Core Frequency/L2 Cache Frequency (300MHz/ 150MHz, 350MHz/175MHz)
■ Maximum 60x Bus frequency = 66MHz

FEATURES
The WED3C755E8M-XBX is offered in Commercial (0°C to +70°C), industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, fl ight computers, fi re control systems and rugged critical systems.
■ Footprint compatible with WED3C7558M-XBX and WED3C750A8M-200BX
■ Footprint compatible with Motorola MPC 745

 

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