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Part Name(s) : ATS1376-ND ATS1376
Advanced Thermal Solutions, Inc.
Advanced Thermal Solutions, Inc.
Description : Low Profile, High Performance Cooling

Low Profile, High Performance Cooling Solutions w/Thermal Tape Attachment*

Features & Benefits
   blueIcE™ heat sinks feature an ultra Low profile for tough-to-cool applications
   Designed for High Performance in Low air velocities
   Ideal for telecommunications applications where space is limited
   comes preassembled with High Performance thermal interface material

Part Name(s) : ATS1377 ATS1377-ND
Advanced Thermal Solutions, Inc.
Advanced Thermal Solutions, Inc.
Description : Low Profile, High Performance Cooling

Low Profile, High Performance Cooling Solutions w/Thermal Tape Attachment*

Features & Benefits
   blueIcE™ heat sinks feature an ultra Low profile for tough-to-cool applications
   Designed for High Performance in Low air velocities
   Ideal for telecommunications applications where space is limited
   Comes preassembled with High Performance thermal interface material

Part Name(s) : ATS1379 ATS1379-ND
Advanced Thermal Solutions, Inc.
Advanced Thermal Solutions, Inc.
Description : Low Profile, High Performance Cooling

Low Profile, High Performance Cooling Solutions w/Thermal Tape Attachment

Features & Benefits
   blueIcE™ heat sinks feature an ultra Low profile for tough-to-cool applications
   Designed for High Performance in Low air velocities
   Ideal for telecommunications applications where space is limited
   comes preassembled with High Performance thermal interface material

Part Name(s) : ATS1378 ATS1378-ND
Advanced Thermal Solutions, Inc.
Advanced Thermal Solutions, Inc.
Description : Low Profile, High Performance Cooling

Low Profile, High Performance Cooling Solutions w/Thermal Tape Attachment*

Features & Benefits
   blueIcE™ heat sinks feature an ultra Low profile for tough-to-cool applications
   Designed for High Performance in Low air velocities
   Ideal for telecommunications applications where space is limited
   comes preassembled with High Performance thermal interface material

Part Name(s) : LED34-HIGH-SMD3
Roithner LaserTechnik GmbH
Roithner LaserTechnik GmbH
Description : Mid-Infrared Light Emitting Diode, SMD

Mid-Infrared Light Emitting Diode, SMD

Light Emitting Diodes with central wavelength 3.40 µm series are based on heterostructures grown on InAs substrates by MOCVD. InAs is used in the active layer. Wide band gap solid solutions InAsSbP with P content 50% are used for god electron confinement.
LED34-HIGH-SMD3 has a stable ouput power and a lifetime more then 80000 hours.

Features
• Structure: InAsSb/InAsSbP
• Peak Wavelength: typ. 3.40 µm
• Optical Ouput Power: typ. 65 µW qCW
• Package: SMD 3x3 mm

Part Name(s) : LED34-HIGH-SMD5
Roithner LaserTechnik GmbH
Roithner LaserTechnik GmbH
Description : Mid-Infrared Light Emitting Diode, SMD

Mid-Infrared Light Emitting Diode, SMD

Light Emitting Diodes with central wavelength 3.40 µm series are based on heterostructures grown on InAs substrates by MOCVD. InAs is used in the active layer. Wide band gap solid solutions InAsSbP with P content 50% are used for god electron confinement.
LED34-HIGH-SMD5 has a stable ouput power and a lifetime more then 80000 hours.

Features
• Structure: InAsSb/InAsSbP
• Peak Wavelength: typ. 3.40 µm
• Optical Ouput Power: typ. 65 µW qCW
• Package: SMD 5x5 mm

Part Name(s) : LED34-HIGH-SMD5R
Roithner LaserTechnik GmbH
Roithner LaserTechnik GmbH
Description : Mid-Infrared Light Emitting Diode, SMD

Mid-Infrared Light Emitting Diode, SMD

Light Emitting Diodes with central wavelength 3.40 µm series are based on heterostructures grown on InAs substrates by MOCVD. InAs is used in the active layer. Wide band gap solid solutions InAsSbP with P content 50% are used for god electron confinement.
LED34-HIGH-SMD5R has a stable ouput power and a lifetime more then 80000 hours.

Features
• Structure: InAsSb/InAsSbP
• Peak Wavelength: typ. 3.40 µm
• Optical Ouput Power: typ. 65 µW qCW
• Package: SMD 5x5 mm with microreflector

Part Name(s) : IRF6668
International Rectifier
International Rectifier
Description : DirectFET™ Power MOSFET

RoHS compliant containing no lead or bromide
Low Profile (<0.7 mm)
Dual Sided Cooling Compatible
Ultra Low Package Inductance
Optimized for High Frequency Switching
Ideal for High Performance Isolated Converter Primary Switch Socket
Optimized for Synchronous Rectification
Low Conduction Losses
Compatible with existing Surface Mount Techniques

International Rectifier
International Rectifier
Description : DirectFET™ Power MOSFET

RoHs Compliant
Lead-Free (Qualified up to 260°C Reflow)
Application Specific MOSFETs
Ideal for High Performance Isolated Converter Primary Switch Socket
Optimized for Synchronous Rectification
Low Conduction Losses
High Cdv/dt Immunity
Low Profile (<0.7mm)
Dual Sided Cooling Compatible
Compatible with existing Surface Mount Techniques

Part Name(s) : BSB012NE2LXI
Infineon Technologies
Infineon Technologies
Description : Metal Oxide Semiconductor Field Effect Transistor

Features
• Optimized SyncFET for High Performance Buck converter
• Integrated monolithic Schottky like diode
Low profile(<0.7mm)
• 100% avalanche tested
• 100% RG Tested
• Double-sided Cooling
• Compatible with DirectFET® package MX footprint and outline1)
• Qualified according to JEDEC2) for target applications
• Pb-free lead plating; RoHS compliant

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