LAYOUT – TOP SIDE
SMB135
Figure 10 – Example Layout. The top side layout provides space (U2) for an SMB135 device packaged in a
leadless QFN package (Not to Scale).
LAYOUT – BOTTOM SIDE
Figure 11 – Example Layout. The bottom side layout provides space (U3) for a SMB135E device packaged in a
CSP package.
Summit Microelectronics, Inc
2106 3.1 11/4/2008
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