24128 View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

24128

128-Kbit serial I²C bus EEPROM

STMicroelectronics 

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Package information

M24128-BW M24128-BR M24128-BF M24128-DF

Table 22. WLCSP - 8-bump, 1.289 x 1.099 mm, 0.4 mm pitch wafer level chip scale

package mechanical data (continued)

e3

-

0.400

-

-

0.0157

-

F

-

0.203

-

-

0.0080

-

G

-

0.245

-

-

0.0096

-

H

-

0.203

-

-

0.0080

-

aaa

-

0.110

-

0.0043

-

bbb

-

0.110

-

0.0043

-

ccc

-

0.110

-

0.0043

-

ddd

-

0.060

-

0.0024

-

eee

-

0.060

-

0.0024

-

1. Values in inches are converted from mm and rounded to 4 decimal digits.

2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

Figure 23. WLCSP - 8-bump, 1.289 x 1.099 mm, 0.4 mm pitch wafer level chip scale

package recommended footprint

PP

PP

PP

1. Dimensions are expressed in millimeters.

PP

EXPSV[¹PP

&KB)3B9

40/46

DocID16892 Rev 30

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