24FC256IMF View Datasheet(PDF) - Microchip Technology
Part Name
Description
MFG CO.
'24FC256IMF' PDF : 26 Pages View PDF
24AA256/24LC256/24FC256
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
Temperature
Range
/XX
Package
X
Lead
Finish
Device:
24AA256:
24AA256T:
24LC256:
24LC256T:
24FC256:
24FC256T:
256 Kbit 1.8V I2C Serial
EEPROM
256 Kbit 1.8V I2C Serial
EEPROM Tape and Reel)
256 Kbit 2.5V I2C Serial
EEPROM
256 Kbit 2.5V I2C Serial
EEPROM Tape and Reel)
256 Kbit High Speed I2C Serial
EEPROM
256 Kbit High Speed I2C Serial
EEPROM Tape and Reel)
Temperature I = -40°C to +85°C
Range:
E = -40°C to +125°C
Examples:
a) 24AA256-I/P: Industrial Temp.,
1.8V, PDIP package.
b) 24AA256T-I/SN: Tape and Reel,
Industrial Temp., 1.8V, SOIC
package.
c) 24AA256-I/ST: Industrial Temp.,
1.8V, TSSOP package.
d) 24AA256-I/MS: Industrial Temp.,
1.8V, MSOP package.
e) 24LC256-E/P: Extended Temp.,
2.5V, PDIP package.
f) 24LC256-I/SN: Industrial Temp.,
2.5V, SOIC package.
g) 24LC256T-I/SN: Tape and Reel,
Industrial Temp., 2.5V, SOIC
package.
h) 24LC256-I/MS: Industrial Temp,
2.5V, MSOP package.
Package:
Lead Finish:
P = Plastic DIP (300 mil body), 8-lead
SN = Plastic SOIC (150 mil body), 8-lead
SM = Plastic SOIC (208 mil body), 8-lead
ST = Plastic TSSOP (4.4 mm), 8-lead
MF = Dual, Flat, No Lead (DFN)(6x5 mm
body), 8-lead
MS = Plastic Micro Small Outline (MSOP),
8-lead
Blank= Pb-free – Matte Tin (see Note 1)
G = Pb-free – Matte Tin only
i) 24FC256-I/P: Industrial Temp,
1.8V, High Speed, PDIP package.
j) 24FC256-I/SN: Industrial Temp,
1.8V, High Speed, SOIC package.
k) 24FC256T-I/SN: Tape and Reel,
Industrial Temp, 1.8V, High Speed,
SOIC package
l) 24LC256T-I/STG: Industrial Temp,
2.5V, TSSOP package, Tape & Reel,
Pb-free
m) 24LC256-I/PG: Industrial Temp,
2.5V, PDIP package, Pb-free
Note 1: Most products manufactured after January 2005 will have a Matte Tin (Pb-free) finish. Most products
manufactured before January 2005 will have a finish of approximately 63% Sn and 37% Pb (Sn/Pb). Please
visit www.microchip.com for the latest information on Pb-free conversion, including conversion date codes.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences
and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of
the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
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© 2005 Microchip Technology Inc.
DS21203N-page 23
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