25AA160C-I View Datasheet(PDF) - Microchip Technology
Part Name
Description
MFG CO.
'25AA160C-I' PDF : 34 Pages View PDF
25XX160C/D
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
–
X
Tape & Reel Temp Range
/XX
Package
Device:
Tape & Reel:
Temperature
Range:
25AA160C
25AA160D
25LC160C
25LC160D
16 Kbit, 1.8V, 16 Byte Page SPI Serial EEPROM
16 Kbit, 1.8V, 32 Byte Page SPI Serial EEPROM
16 Kbit, 2.5V, 16 Byte Page SPI Serial EEPROM
16 Kbit, 2.5V, 32 Byte Page SPI Serial EEPROM
Blank =
T
=
I
=
E
=
Standard packaging
Tape & Reel
-40C to+85C
-40C to+125C
Examples:
a) 25AA160C-I/MS = 16 Kbit, 16-byte page, 1.8V
Serial EEPROM, Industrial temp., MSOP
package
b) 25AA160CT-I/SN = 16 Kbit, 16-byte page, 1.8V
Serial EEPROM, Industrial temp., Tape & Reel,
SOIC package
c) 25LC160DT-I/SN = 16 Kbit, 32-byte page, 2.5V
Serial EEPROM, Industrial temp., Tape & Reel,
SOIC package
d) 25LC160DT-I/ST = 16 Kbit, 32-byte page, 2.5V
Serial EEPROM, Industrial temp., Tape & Reel,
TSSOP package
e) 25AA160DT-E/SN = 16 Kbit, 32-byte page,
1.8V Serial EEPROM, Extended temp., Tape &
Reel, SOIC package
Package:
Note 1:
MS =
P
=
SN =
ST =
MNY(1) =
Plastic MSOP (Micro Small Outline), 8-lead
Plastic DIP (300 mil body), 8-lead
Plastic SOIC (3.90 mm body), 8-lead
TSSOP, 8-lead
8-lead 2x3 mm TDFN
“Y” indicates a Nickel Palladium Gold (NiPdAu) finish.
2009-2013 Microchip Technology Inc.
DS22150B-page 31
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