5962F0723301VXC View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'5962F0723301VXC' PDF : 22 Pages View PDF
Package information
8.1
Ceramic Flat-8 package information
Figure 28. Ceramic Flat-8 package mechanical drawing
RHF310
Note:
The upper metallic lid is not electrically connected to any pins, nor to the IC die inside the
package. Connecting unused pins or metal lid to ground or to the power supply will not affect
the electrical characteristics.
Table 6.
Ref.
A
b
c
D
E
E2
E3
e
L
Q
S1
N
Ceramic Flat-8 package mechanical data
Dimensions
Millimeters
Min.
Typ.
Max.
Min.
2.24
2.44
2.64
0.088
0.38
0.43
0.48
0.015
0.10
0.13
0.16
0.004
6.35
6.48
6.61
0.250
6.35
6.48
6.61
0.250
4.32
4.45
4.58
0.170
0.88
1.01
1.14
0.035
1.27
3.00
0.66
0.79
0.92
0.026
0.92
1.12
1.32
0.036
08
Inches
Typ.
0.096
0.017
0.005
0.255
0.255
0.175
0.040
0.050
0.118
0.031
0.044
08
Max.
0.104
0.019
0.006
0.260
0.260
0.180
0.045
0.092
0.052
20/22
Doc ID 15577 Rev 3
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