A4985
DMOS Microstepping Driver with Translator
And Overcurrent Protection
LP Package, 24-Pin TSSOP with Exposed Thermal Pad
7.80 ±0.10
24
A
12
24X
0.10 C
0.25
+0.05
–0.06
B
4.32±0.05
0.65
3.00±0.05 4.40 ±0.10 6.40 ±0.20
4° ±4
0.15
+0.05
–0.06
0.60 ±0.15
(1.00)
0.65
0.45
3.00
6.10
C
SEATING
PLANE
1.20 MAX
0.15 MAX
0.25
SEATING PLANE
GAUGE PLANE
1.65
4.32
C PCB Layout Reference View
For reference only
(reference JEDEC MO-153 ADT)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
A Terminal #1 mark area
B Exposed thermal pad (bottom surface)
C Reference land pattern layout (reference IPC7351
TSOP65P640X120-25M); all pads a minimum of 0.20 mm from all
adjacent pads; adjust as necessary to meet application process
requirements and PCB layout tolerances; when mounting on a multilayer
PCB, thermal vias at the exposed thermal pad land can improve thermal
dissipation (reference EIA/JEDEC Standard JESD51-5)
Allegro MicroSystems, Inc.
21
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com