A9210-B View Datasheet(PDF) - AMIC Technology
Part Name
Description
MFG CO.
'A9210-B' PDF : 13 Pages View PDF
Ver 1.1 Short Form
Gold Bump Specification
A9210-B
13.56MHz RFID TAG IC
․ Bump material:
>99.9% pure Au
․ Bump hardness:
35 – 80 HV 0.005
․ Bump shear strength:
>70MPa
․ Bump height:
15 ± 3um
․ Bump height uniformly:
– Within a die
± 2 um
– Within a wafer
± 3 um
– Wafer to wafer
± 4 um
․ Bump flatness:
± 1.5 um
․ Bump size:
– ANTP, ANTM, TIO1,
TIO2, TIO3:
– Variation:
ANTP, ANTM: 114um x 114um;
TIO1, TIO2, TIO3: 60um x 60um
± 5 um
․ Under bump metallization: Sputtered TiW
p11 of 13
Ver. 1.1
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