ACPM-5011-TR1 View Datasheet(PDF) - Avago Technologies
Part Name
Description
MFG CO.
ACPM-5011-TR1
Avago Technologies
'ACPM-5011-TR1' PDF : 13 Pages View PDF
Reflow Profile Recommendations
Tp
TL
Tsmax
Tsmin
ts
Preheat
tp
Ramp-up
tL
Critical Zone
TL to Tp
Ramp-down
25
t 25° C to Peak
Time
Typical SMT Reflow Profile for Maximum Temperature = 260 +0/-5° C
Typical SMT Reflow Profile for Maximum Temperature = 260 +0/-5° C
Profile Feature
Average ramp-up rate (TL to TP)
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
Tsmax to TL
– Ramp-up Rate
Time maintained above:
– Temperature (TL)
– Time (TL)
Peak temperature (TP)
Time within 5° C of actual Peak Temperature (TP)
Ramp-down Rate
Time 25° C to Peak Temperature
Sn-Pb Solder
3° C/sec max
100° C
150° C
60-120 sec
183° C
60-150 sec
240 +0/-5° C
10-30 sec
6° C/sec max
6 min max.
Pb-Free Solder
3° C/sec max
150° C
200° C
60-180 sec
3° C/sec max
217° C
60-150 sec
260 +0/-5° C
20-40 sec
6° C/sec max
8 min max.
11
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