ACPM-7371 View Datasheet(PDF) - Avago Technologies
Part Name
Description
MFG CO.
'ACPM-7371' PDF : 15 Pages View PDF
Tp
TL
Tsmax
Tsmin
ts
Preheat
Ramp-up
tp
tL
Ramp-down
25
t 25°C to Peak
Time
Figure 17. Typical SMT Reflow Profile for Maximum Temperature = 260 +0/-5°C
Critical Zone
TL to Tp
Table 7. Typical SMT Reflow Profile for Maximum Temperature = 260+0 / -5°C
Profile Feature
Average ramp-up rate (TL to TP)
Sn-Pb Solder
3°C/sec max
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
100°C
150°C
60-120 sec
Tsmax to TL
- Ramp-up Rate
Time maintained above:
- Temperature (TL)
- Time (TL)
183°C
60-150 sec
Peak temperature (Tp)
240 +0/-5°C
Time within 5°C of actual Peak Temperature (tp)
10-30 sec
Ramp-down Rate
6°C /sec max
Time 25°C to Peak Temperature
6 min max.
Pb-Free Solder
3° C/sec max
150°C
200°C
60-180 sec
3°C /sec max
217°C
60-150 sec
260 +0/-5°C
20-40 sec
6°C /sec max
8 min max.
13
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