ACS711ELCTR-25AB-T View Datasheet(PDF) - Allegro MicroSystems

Part Name

Description

MFG CO.

ACS711ELCTR-25AB-T

Hall Effect Linear Current Sensor with Overcurrent Fault Output for <100 V Isolation Applications

Allegro MicroSystems 

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ACS711

Hall Effect Linear Current Sensor with Overcurrent

Fault Output for < 100 V Isolation Applications

Application Information

Layout

To optimize thermal and electrical performance, the

following features should be included in the printed

circuit board:

• The primary leads should be connected to as much

copper area as is available.

• The copper should be 2 oz. or heavier.

• Additional layers of the board should be used for

conducting the primary current if possible, and

should be connected using the arrangement of vias

shown below.

• The two solder pads at the ends of the exposed pad

loop should be placed directly on the copper trace

that conducts the primary current.

• When using vias under exposed pads, such as with

the EX package, using plugged vias prevents wicking

of the solder from the pad into the via during reflow.

Whether or not to use plugged vias should be evalu-

ated in the application.

Signal traces

Exposed pad loop

EX package

footprint

Solder pads

Via under pad

Via

Primary Current Trace

Suggested Layout. EX package shown.

Primary Current Trace

Allegro MicroSystems, LLC

15

115 Northeast Cutoff

Worcester, Massachusetts 01615-0036 U.S.A.

1.508.853.5000; www.allegromicro.com

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