ACS8515LC View Datasheet(PDF) - Semtech Corporation
Part Name
Description
MFG CO.
'ACS8515LC' PDF : 50 Pages View PDF
ACS8515 Rev2.1 LC/P
ADVANCED COMMUNICATIONS
Table 30. 64 Pin LQFP Package Dimension Data (for use with Figure 16)
FINAL
64 LQFP
Package D/E D1/E1 A
A1 A2
e AN1 AN2 AN3 AN4 R1 R2
L
Dimensions
in mm
L1 S
b b1 c c1
Min
1.40 0.05 1.35
11° 11° 0° 0° 0.08 0.08 0.45
0.20 0.17 0.17 0.09 0.09
Nom
12.00 10.00 1.50 0.10 1.40 0.50 12° 12° - 3.5° -
-
0.60
1.00
(ref)
-
0.22 0.20
-
-
Max
1.60 0.15 1.45
13° 13° -
7° - 0.20 0.75
- 0.27 0.23 0.20 0.16
Thermal Conditions
The device is rated for full temperature range when this package is used with a 4 layer or more
PCB. Copper coverage must exceed 50%. All pins must be soldered to the PCB. Maximum
operating temperature must be reduced when the device is used with a PCB with less than these
requirements.
Figure 17. Typical 64 Pin LQFP Footprint
1.85 mm
Pitch 0.5 mm
Width 0.3 mm
Notes
(1) Solderable to this limit.
Square package - dimensions apply in both X and Y directions.
Typical example - the user is responsible for ensuring compatibility with PCB manufacturing process, etc.
Revision 2.01/December 2005 Semtech Corp.
47
www.semtech.com
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