ACS8520 View Datasheet(PDF) - Semtech Corporation
Part Name
Description
MFG CO.
'ACS8520' PDF : 150 Pages View PDF
ACS8520 SETS
ADVANCED COMMUNICATIONS
Thermal Conditions
FINAL
DATASHEET
The device is rated for full temperature range when this package is used with a 4 layer or more PCB. Copper coverage
must exceed 50%. All pins must be soldered to the PCB. Maximum operating temperature must be reduced when the
device is used with a PCB with less than these requirements.
Figure 30 Typical 100 Pin LQFP Footprint
1.85 mm
Pitch 0.5 mm
Not Drawn to Scale
Width 0.3 mm
F8530D_030QFNFootprt100_02
Notes: (i) Solderable to this limit.
(ii) Square package - dimensions apply in both X and Y directions.
(iii) Typical example. The user is responsible for ensuring compatibility with PCB manufacturing process, etc.
Revision 3.02/October 2005 © Semtech Corp.
Page 144
www.semtech.com
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