ACS8527 View Datasheet(PDF) - Semtech Corporation
Part Name
Description
MFG CO.
'ACS8527' PDF : 22 Pages View PDF
ACS8527 MUXPLL
ADVANCED COMMUNICATIONS
Thermal Conditions
FINAL
DATASHEET
The device is rated for full temperature range when this package is used with a 4 layer or more PCB. Copper coverage
must exceed 50%. All pins must be soldered to the PCB. Maximum operating temperature must be reduced when the
device is used with a PCB with less than these requirements.
Figure 7 Typical 64-Pin LQFP Package Landing Pattern
Revision 4.01/June 2006 © Semtech Corp.
Page 17
www.semtech.com
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