AD9516-1/PCBZ View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
'AD9516-1/PCBZ' PDF : 84 Pages View PDF
AD9516-1
Data Sheet
THERMAL PERFORMANCE
Table 51. Thermal Parameters for the 64-Lead LFCSP
Symbol Thermal Characteristic Using a JEDEC JESD51-7 Plus JEDEC JESD51-5 2S2P Test Board
θJA
Junction-to-ambient thermal resistance, natural convection per JEDEC JESD51-2 (still air)
θJMA
Junction-to-ambient thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
θJMA
Junction-to-ambient thermal resistance, 2.0 m/sec airflow per JEDEC JESD51-6 (moving air)
ΨJB
Junction-to-board characterization parameter, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
and JEDEC JESD51-8
θJC
Junction-to-case thermal resistance (die-to-heat sink) per MIL-STD-883, Method 1012.1
ΨJT
Junction-to-top-of-package characterization parameter, natural convection per JEDEC JESD51-2 (still air)
Value (°C/W)
22.0
19.2
17.2
11.6
1.3
0.1
The AD9516 is specified for a case temperature (TCASE). To ensure
that TCASE is not exceeded, an airflow source can be used.
Use the following equation to determine the junction
temperature on the application PCB:
TJ = TCASE + (ΨJT × PD)
where:
TJ is the junction temperature (°C).
TCASE is the case temperature (°C) measured by the user at the
top center of the package.
ΨJT is the value from Table 51.
PD is the power dissipation of the device (see Table 17).
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first-order
approximation of TJ by the following equation:
TJ = TA + (θJA × PD)
where TA is the ambient temperature (°C).
Values of θJC are provided for package comparison and PCB
design considerations when an external heat sink is required.
Values of ΨJB are provided for package comparison and PCB
design considerations.
Rev. C | Page 54 of 80
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