ADCMP566 View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
'ADCMP566' PDF : 16 Pages View PDF
ADCMP566
OUTLINE DIMENSIONS
5.00
BSC SQ
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
TOP
VIEW
4.75
BSC SQ
0.50
BSC
25
24
32 1
BOTTOM
VIEW
0.50
0.40
0.30
1716
98
12° MAX
0.80 MAX
0.65 NOM
3.50
REF
1.00
0.90
0.80
SEATING
PLANE
0.05 MAX
0.02 NOM
0.30
0.23
0.20 REF
COPLANARITY
0.08
0.18
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
Figure 23. 32-Lead Lead Frame Chip Scale Package [LFCSP]
(CP-32)
Dimensions shown in millimeters
PIN 1
INDICATOR
3.25
2.70 SQ
1.25
ORDERING GUIDE
Model
ADCMP566BCP
Temperature Range
−40°C to +85°C
Package Description
LFCSP-32
Package Option
CP-32
Rev. 0 | Page 14 of 16
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