ADG904 View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
ADG904
Analog Devices
'ADG904' PDF : 17 Pages View PDF
Data Sheet
ADG904/ADG904-R
OUTLINE DIMENSIONS
6.60
6.50
6.40
20
11
4.50
4.40
4.30
6.40 BSC
1
10
PIN 1
0.65
BSC
0.15
1.20 MAX
0.20
0.05
0.09
0.75
0.30
COPLANARITY 0.19
8°
SEATING
0°
0.60
0.45
0.10
PLANE
COMPLIANT TO JEDEC STANDARDS MO-153-AC
Figure 31. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
4.10
4.00 SQ
3.90
TOP VIEW
0.50
BSC
0.30
0.25
0.18
16
15
20
1
EXPOSED
PAD
PIN 1
INDICATOR
2.30
2.10 SQ
2.00
11
5
0.65
0.60
10
6
BOTTOM VIEW
0.20 MIN
0.55
0.05 MAX
0.02 NOM
COPLANARITY
0.08
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD-1.
Figure 32. 20-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-20-6)
Dimensions shown in millimeters
Rev. C | Page 13 of 16
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