ADJD-J823 View Datasheet(PDF) - Avago Technologies
Part Name
Description
MFG CO.
'ADJD-J823' PDF : 18 Pages View PDF
Recommended Reflow Profile
It is recommended that Henkel Pb-free solder paste LF310 be used for soldering ADJD-J823. Below is the recom-
mended soldering profile.
230 ± 5 ˚C
T -peak
T -reflow 218 ˚C
T -max
160 ˚C
Delta -flux = 2˚C/sec max
Delta -cooling = 2˚C/sec max
T -min 120 ˚C
Delta -ramp = 1˚C/sec max
t -pre = 40-60 sec max
TIME
t -reflow = 20 - 40 sec max
20 Lead QFN Recommended PCB Land Pad Design
IPC-SM-782 is used as the standard for the PCB land pad
design. Recommended PCB finishing is gold plated.
20 Lead QFN Recommended Stencil Design
A stencil thickness of 2.18mm (6 mils) for this QFN pack-
age is recommended
0.8 mm
0.4 mm
0.8 mm
5.5 mm
3.19 mm
3.19 mm
3.9 mm
5.5 mm
0.4 mm
2.18mm
16
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