ADL5380ACPZ-WP View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
'ADL5380ACPZ-WP' PDF : 36 Pages View PDF
ADL5380
Figure 99. Low Band Evaluation Board Top Layer
Figure 101. Low Band Evaluation Board Bottom Layer
Figure 100. Midband/High Band Evaluation Board Top Layer Silkscreen
Figure 102. Midband/High Band Evaluation Board Bottom Layer Silkscreen
THERMAL GROUNDING AND EVALUATION
BOARD LAYOUT
The package for the ADL5380 features an exposed paddle on the
underside that should be well soldered to a low thermal and
electrical impedance ground plane. This paddle is typically
soldered to an exposed opening in the solder mask on the
evaluation board. Figure 103 illustrates the dimensions used in
the layout of the ADL5380 footprint on the ADL5380 evaluation
board (1 mil = 0.0254 mm).
Notice the use of nine via holes on the exposed paddle. These
ground vias should be connected to all other ground layers on
the evaluation board to maximize heat dissipation from the
device package.
25 mil.
12 mil.
23 mil.
82 mil.
12 mil.
19.7 mil.
98.4 mil.
133.8 mil.
Figure 103. Dimensions for Evaluation Board Layout for the ADL5380 Package
Under these conditions, the thermal impedance of the ADL5380
was measured to be approximately 30°C/W in still air.
Rev. 0 | Page 34 of 36
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