ADP130 View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
'ADP130' PDF : 20 Pages View PDF
In cases where board temperature is known, use the thermal char-
acterization parameter, ΨJB, to estimate the junction temperature
rise. Maximum junction temperature (TJ) is calculated from the
board temperature (TB) and power dissipation (PD), using the
following formula:
TJ = TB + (PD × ΨJB)
(5)
The typical value of ΨJB is 42.8°C/W for the 5-lead TSOT package.
140
MAX TJ (DO NOT OPERATE ABOVE THIS POINT)
120
100
80
60
40
20
0
0.4
1mA
10mA
50mA
100mA
150mA
350mA
250mA (LOAD CURRENT)
0.8
1.2
1.6
2.0
2.4
2.8
VIN – VOUT (V)
Figure 46. TSOT, TA = 85°C
ADP130
PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
Heat dissipation from the package can be improved by increasing
the amount of copper attached to the pins of the ADP130.
However, as shown in Table 6, a point of diminishing returns is
eventually reached, beyond which an increase in the copper size
does not yield significant heat dissipation benefits.
The input capacitor should be placed as close as possible to the
VIN and GND pins. The output capacitor should be placed as
close as possible to the VOUT and GND pins. Using 0402 or 0603
size capacitors and resistors achieves the smallest possible foot-
print solution on boards where the area is limited.
GND
GND
ANALOG DEVICES
ADP130-xx-EVALZ
C1
C2
U1
J1
VIN
VOUT
C3
GND
EN
VBIAS
GND
Figure 47. Example TSOT PCB Layout
Rev. 0 | Page 17 of 20
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