ADSP-21266SKBCZ-2B View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
'ADSP-21266SKBCZ-2B' PDF : 44 Pages View PDF
ADSP-21266
10
8
6
Y = 0.0488X – 1.5923
4
2
0
–2
–4
0
50
100
150
200
LOAD CAPACITANCE (pF)
Figure 33. Typical Output Delay or Hold vs. Load Capacitance
(at Ambient Temperature)
ENVIRONMENTAL CONDITIONS
The ADSP-21266 processor is rated for performance under
TAMB environmental conditions specified in the Recommended
Operating Conditions on Page 15.
THERMAL CHARACTERISTICS
Table 33 and Table 34 airflow measurements comply with
JEDEC standards JESD51-2 and JESD51-6 and the junction-to-
board measurement complies with JESD51-8. The junction-to-
case measurement complies with MIL-STD-883. All measure-
ments use a 2S2P JEDEC test board.
To determine the junction temperature of the device while on
the application PCB, use
TJ = TCASE + (ΨJT × PD)
where:
TJ = junction temperature (°C)
TCASE = case temperature (°C) measured at the top center of the
package
ΨJT = junction-to-top (of package) characterization parameter is
the typical value from Table 33 and Table 34.
PD = power dissipation (see EE Note No. 216)
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first order approxi-
mation of TJ by the equation
TJ = TA + (θJA × PD)
where:
TA = ambient temperature °C
Values of θJC are provided for package comparison and PCB
design considerations when an external heat sink is required.
Table 33. Thermal Characteristics for 136-Ball BGA
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJMT
ΨJMT
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
31.0
27.3
26.0
6.99
0.16
0.30
0.35
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Table 34. Thermal Characteristics for 144-Lead LQFP
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJMT
ΨJMT
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
32.5
28.9
27.8
7.8
0.5
0.8
1.0
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Rev. B | Page 38 of 44 | May 2005
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