ADSP-21266SKSTZ-1C View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
'ADSP-21266SKSTZ-1C' PDF : 44 Pages View PDF
PACKAGE DIMENSIONS
The ADSP-21266 is available in a 136-ball BGA package and a
144-lead LQFP package shown in Figure 35 and Figure 36.
ADSP-21266
12.00 BSC SQ
PIN A1 INDICATOR
1.70
MAX
TOP VIEW
0.80
BSC
TYP
A
B
C
D
E
F
G
H
J
K
L
M
N
P
10.40 BSC SQ
14 13 12 11 10 9 8 7 6 5 4 3 2 1
DETAIL A
BOTTOM VIEW
0.80
BSC
TYP
1. DIMENSIONS ARE IN MILIMETERS (MM).
2. THE ACTUAL POSITION OF THE BALL GRID IS
WITHIN 0.15 MM OF ITS IDEAL POSITION RELATIVE
TO THE PACKAGE EDGES.
3. COMPLIANT TO JEDEC STANDARD MO-205-AE, EXCEPT FOR
THE BALL DIAMETER.
4. CENTER DIMENSIONS ARE NOMINAL.
0.25
MIN
0.50
0.45
0.40
(BALL
DIAMETER)
DETAIL A
Figure 35. 136-Ball BGA (BC-136-3)
SEATING
PLANE
0.12 MAX (BALL
COPLANARITY)
0.27
0.22 TYP
0.17
SEATING
PLANE
0.08 MAX (LEAD
COPLANARITY)
0.15
0.05
0.75
0.60 TYP
0.45
1.45
1.40
1.35
1.60 MAX
DETAIL A
0.50
BSC
TYP
(LEAD
PITCH)
22.00 BSC SQ
20.00 BSC SQ
144
1
PIN 1 INDICATOR
109
108
36
37
73
72
1. DIMENSIONS ARE IN MILLIMETERS
AND COMPLY WITH JEDEC
STANDARD MS-026-BFB.
2. ACTUAL POSITION OF EACH LEAD
IS WITHIN 0.08 OF ITS IDEAL POSITION
WHEN MEASURED IN THE LATERAL
DIRECTION.
3. CENTER DIMENSIONS ARE NOMINAL.
DETAIL A
TOP VIEW (PINS DOWN)
Figure 36. 144-Lead LQFP (ST-144-2)
Rev. B | Page 43 of 44 | May 2005
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