ADSP-21369 View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
'ADSP-21369' PDF : 56 Pages View PDF
ADSP-21367/ADSP-21368/ADSP-21369
A1 BALL
INDICATOR
TOP VIEW
27.00
BSC SQ
DETAIL A
A1 CORNER
INDEX AREA
20 18 16 14 12 10 8 6 4 2
19 17 15 13 11 9 7 5 3 1
A
B
C
D
E
F
BOTTOM
G
VIEW
H
J
K
L
M
N
P
R
T
U
V
W
Y
24.13
REF SQ
1.27
NOM
0.70
0.60
0.50
1.00
0.80
0.60
DETAIL A
1.70 MAX
0.10
MIN
0.20
COPLANARITY
COMPLIES WITH JEDEC STANDARD MO-192-BAL-2.
0.90
BALL
DIAMETER
0.75
0.60
SEATING
PLANE
0.25 MIN 4ϫ
Figure 50. 256-Ball Ball Grid Array, Thermally Enhanced [BGA_ED]
(BP-256)
Dimension shown in millimeters
SURFACE-MOUNT DESIGN
Table 48 is provided as an aide to PCB design. For industry-
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface-Mount Design and Land Pattern
Standard.
Table 48. BGA_ED Data for Use with Surface-Mount Design
Package
256-Lead Ball Grid Array BGA_ED
(BP-256)
Ball Attach Type
Solder Mask Defined (SMD)
Solder Mask Opening
0.63 mm
Ball Pad Size
0.73 mm
Rev. C | Page 54 of 56 | January 2008
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