ADSP-21469KBZ-ENG2 View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
'ADSP-21469KBZ-ENG2' PDF : 56 Pages View PDF
Preliminary Technical Data
12
10
8
TBD
6
4
2
0
0
50
100
150
200
250
Figure 44. Typical Output Delay or Hold vs. Load Capacitance
(at Ambient Temperature)
THERMAL CHARACTERISTICS
The ADSP-21469 processor is rated for performance over the
temperature range specified in Operating Conditions on
Page 16.
Table 47 airflow measurements comply with JEDEC standards
JESD51-2 and JESD51-6 and the junction-to-board measure-
ment complies with JESD51-8. Test board design complies with
JEDEC standards JESD51-7 (PBGA). The junction-to-case mea-
surement complies with MIL- STD-883. All measurements use a
2S2P JEDEC test board.
To determine the junction temperature of the device while on
the application PCB, use:
TJ = TCASE + (ΨJT × PD)
where:
TJ = junction temperature °C
TCASE = case temperature (°C) measured at the top center of the
package
ΨJT = junction-to-top (of package) characterization parameter
is the Typical value from Table 47.
PD = power dissipation
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first order approxi-
mation of TJ by the equation:
TJ = TA + (θJA × PD)
where:
TA = ambient temperature °C
Values of θJC are provided for package comparison and PCB
design considerations when an external heatsink is required.
ADSP-21469/ADSP-21469W
Values of θJB are provided for package comparison and PCB
design considerations. Note that the thermal characteristics val-
ues provided in Table 47 are modeled values.
Table 47. Thermal Characteristics for 324-Lead PBGA
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJMT
ΨJMT
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Rev. PrB | Page 51 of 56 | November 2008
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