ADSP-BF516KSWZ-4 View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
'ADSP-BF516KSWZ-4' PDF : 68 Pages View PDF
ADSP-BF512/BF512F, BF514/BF514F, BF516/BF516F, BF518/BF518F
A1 BALL
CORNER
12.10
12.00 SQ
11.90
TOP VIEW
1.50
DETAIL A
1.40
1.30
10.40
BSC SQ
0.80
BSC
0.80
REF
14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
BOTTOM VIEW
A1 BALL
CORNER
0.70
REF
0.36
REF
SEATING
PLANE
DETAIL A
1.12
1.06
1.00
0.34 NOM
0.29 MIN
0.50
COPLANARITY
0.45
0.20
0.40
BALL DIAMETER
COMPLIANT TO JEDEC STANDARDS MO-275-GGAB-1.
Figure 73. 168-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-168-1)
Dimensions shown in millimeters
SURFACE-MOUNT DESIGN
Table 56 is provided as an aid to PCB design. For industry
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
Table 56. BGA Data for Use with Surface-Mount Design
Package
168-Ball CSP_BGA
Package Ball Attach Type
Solder Mask Defined
Package Solder Mask
Opening
0.35 mm diameter
Package Ball Pad Size
0.48 mm diameter
Rev. B | Page 64 of 68 | January 2011
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