ADSP-BF534/ADSP-BF536/ADSP-BF537
SURFACE-MOUNT DESIGN
The following table is provided as an aid to PCB design. For
industry-standard design recommendations, refer to IPC-7351,
Generic Requirements for Surface Mount Design and Land Pat-
tern Standard.
Package
182-Ball CSP_BGA (BC-182)
208-Ball CSP_BGA (BC-208-2)
Package Ball Attach Type
Solder Mask Defined
Solder Mask Defined
Package Solder Mask
Opening
0.40 mm diameter
0.40 mm diameter
Package Ball Pad Size
0.55 mm diameter
0.55 mm diameter
Rev. J | Page 65 of 68 | February 2014