AG603-89PCB View Datasheet(PDF) - WJ Communications => Triquint
Part Name
Description
MFG CO.
'AG603-89PCB' PDF : 5 Pages View PDF
AG603-89
InGaP HBT Gain Block
The Communications Edge TM
Product Information
AG603-89G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 qC reflow temperature) and leaded
(maximum 245 qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Product Marking
The AG603-89G will be marked with an
“A603G” designator with an alphanumeric lot
code marked below the part designator. The
obsolete tin-lead package is marked with an
“AG603” designator followed by an
alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
Land Pattern
MSL / ESD Rating
ESD Rating: Class 1C
Value:
Passes 1000V min.
¤
Test:
Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value:
Passes 1000V min.
¤
Test:
Charged Device Model (CDM)
Standard: JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260 ¢ C convection reflow
Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135” ) diameter drill and have a final plated thru
diameter of .25 mm (.010” ).
Thermal Specifications
1000
Parameter
Rating
Operating Case Temperature
-40 to +85 qC
MTTF vs. GND Tab Temperature
2. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
Thermal Resistance, Rth (1)
Junction Temperature, Tj (2)
154 qC / W
100
145 qC
4. Do not put solder mask on the backside of the PC board in
the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
10
1. The thermal resistance is referenced from the hottest
6. Use 1 oz. Copper minimum.
part of the junction to the ground tab (pin 4).
7. All dimensions are in millimeters (inches). Angles are in
degrees.
2. This corresponds to the typical biasing condition of
1
+5.16V, 75 mA at an 85 ¢ C case temperature. A
minimum MTTF of 1 million hours is achieved for
60 70 80 90 100 110 120
junction temperatures below 177 ¢ C.
Tab Temperature (°C)
Specifications and information are subject to change without notice
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
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Page 5 of 5 June 2006
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