AM29F200AB-90DPE1 View Datasheet(PDF) - Advanced Micro Devices
Part Name
Description
MFG CO.
AM29F200AB-90DPE1
Advanced Micro Devices
'AM29F200AB-90DPE1' PDF : 8 Pages View PDF
SUPPLEMENT
PAD DESCRIPTION
Pad
Signal
Pad Center (mils)
X
Y
1
VCC
0.0
0.0
2
DQ4
8.5
–1.2
3
DQ12
–17.3
–1.2
4
DQ5
–26.1
–1.2
5
DQ13
–34.9
–1.2
6
DQ6
–43.6
–1.2
7
DQ14
–52.4
–1.2
8
DQ7
–61.2
–1.2
9
DQ15/A-1
–69.9
–1.2
10
VSS
–80.2
2.7
11
BYTE#
–82.3
–13.5
12
A16
–82.3
–24.1
13
A15
–82.3
–128.4
14
A14
–82.3
–138.7
15
A13
–82.3
–150.0
16
A12
–68.2
–150.0
17
A11
–57.9
–150.0
18
A10
–47.6
–150.0
19
A9
–36.7
–150.0
20
A8
–26.4
–150.0
21
WE#
–16.1
–150.0
22
RESET#
–5.2
–150.0
23
RY/BY#
26.1
–150.0
24
A7
50.2
–150.0
25
A6
60.5
–150.0
26
A5
70.8
–150.0
27
A4
81.1
–150.0
28
A3
91.4
–150.0
29
A2
91.5
–138.7
30
A1
91.5
–128.4
31
A0
91.5
–24.1
32
CE#
91.5
–13.6
33
VSS
91.1
1.8
34
OE#
79.8
–0.7
35
DQ0
70.0
–1.2
36
DQ8
61.3
–1.2
37
DQ1
52.5
–1.2
38
DQ9
43.7
–1.2
39
DQ2
34.9
–1.2
40
DQ10
26.2
–1.2
41
DQ3
17.4
–1.2
42
DQ11
8.6
–1.2
Pad Center (millimeters)
X
Y
0.0000
0.0000
–0.2159
–0.0305
–0.4394
–0.0305
–0.6629
–0.0305
–0.8865
–0.0305
–1.1074
–0.0305
–1.3310
–0.0305
–1.5545
–0.0305
–1.7755
–0.0305
–2.0371
0.0686
–2.0904
–0.3429
–2.0904
–0.6121
–2.0904
–3.2614
–2.0904
–3.5230
–2.0904
–3.8100
–1.7323
–3.8100
–1.4707
–3.8100
–1.2090
–3.8100
–0.9322
–3.8100
–0.6706
–3.8100
–0.4089
–3.8100
–0.1321
–3.8100
0.6629
–3.8100
1.2751
–3.8100
1.5367
–3.8100
1.7983
–3.8100
2.0599
–3.8100
2.3216
–3.8100
2.3241
–3.5230
2.3241
–3.2614
2.3241
–0.6121
2.3241
–0.3454
2.3139
0.0457
2.0269
–0.0178
1.7780
–0.0305
1.5570
–0.0305
1.3335
–0.0305
1.1100
–0.0305
0.8865
–0.0305
0.6655
–0.0305
0.4420
–0.0305
0.2184
–0.0305
Note: The coordinates above are relative to the center of pad 1 and can be used to operate wire bonding equipment.
4
Am29F200A Known Good Die
1/13/98
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