1 23
.200 [5.08] 8
4
Recommended SMT Attachment
The AMMP Packaged Devices are
compatible with high volume
surface mount PCB assembly
processes.
7 65
.200 [5.08]
Front View
.075 [1.91]
Side View
.011 [0.28]
.018 [0.46]
.114 [2.9]
321
.014 [0.365]
4
.126 [3.2] .059 [1.5]
.100 [2.54]
.029 [0.75]
.100 [2.54]
.016 [0.40]
.016 [0.40]
8
.012 [0.30]
5 67
.028 [0.70]
.093 [2.36]
Dimensional Tolerances: 0.002" [0.05 mm]
Back View
Notes:
1. * Indicates Pin 1
2. Dimensions are in inches [millimeters]
3. All Grounds must be soldered to PCB RF Ground
Figure 22. Outline Drawing.
.011 [0.28]
.093 [2.36]
.010 [0.25]
.126 [3.20] .059 [1.50] .020 [0.50]
.016 [0.40]
.0095 [0.24]
.016 [0.40]
.012 [0.3]
.018 [0.46]
.018 [0.46]
.114 [2.90]
Figure 23. Suggested PCB Material and Land Pattern.
.0095 [0.24]
The PCB material and mounting
pattern, as defined in the data
sheet, optimizes RF performance
and is strongly recommended.
An electronic drawing of the land
pattern is available upon request
from Agilent Sales & Application
Engineering.
Manual Assembly
1. Follow ESD precautions while
handling packages.
2. Handling should be along the
edges with tweezers.
3. Recommended attachment is
conductive solder paste.
Please see recommended
solder reflow profile. Conduc-
tive epoxy is not recom-
mended. Hand soldering is not
recommended.
4. Apply solder paste using a
stencil printer or dot place-
ment. The volume of solder
paste will be dependent on
PCB and component layout
and should be controlled to
ensure consistent mechanical
and electrical performance.
5. Follow solder paste and
vendor’s recommendations
when developing a solder
reflow profile. A standard
profile will have a steady ramp
up from room temperature to
the pre-heat temperature to
avoid damage due to thermal
shock.
6. Packages have been qualified
to withstand a peak tempera-
ture of 260° C for 20 seconds.
Verify that the profile will not
expose device beyond these
limits.
7