APW7062B View Datasheet(PDF) - Anpec Electronics
Part Name
Description
MFG CO.
'APW7062B' PDF : 18 Pages View PDF
APW7062B
Classificatin Reflow Profiles(Cont.)
Table 1. SnPb Entectic Process – Package Peak Reflow Tem peratures
Package Thickness
Volume mm3
Volume mm3
<2.5 mm
<350
240 +0/-5°C
≥350
225 +0/-5°C
≥2.5 mm
225 +0/-5°C
225 +0/-5°C
Table 2. Pb-free Process – Package Classification Reflow Tem peratures
Package Thickness
Volume mm3
Volume mm3
Volume mm3
<350
350-2000
>2000
<1.6 mm
1.6 mm – 2.5 mm
260 +0°C*
260 +0°C*
260 +0°C*
250 +0°C*
260 +0°C*
245 +0°C*
≥2.5 mm
250 +0°C*
245 +0°C*
245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process com patibility up to and
including the stated classification temperature (this m eans Peak reflow tem perature +0°C.
For example 260°C+0°C) at the rated MSL level.
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B,A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
Description
245°C, 5 SEC
1000 Hrs Bias @125°C
168 Hrs, 100%RH, 121°C
-65°C~150°C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms, 1tr > 100mA
Carrier Tape & Reel Dimension
t
E
Po
P
D
P1
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Ao
D1
Ko
Copyright ANPEC Electronics Corp.
17
Rev. A.3 - Mar., 2005
www.anpec.com.tw
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