APW7077 View Datasheet(PDF) - Anpec Electronics
Part Name
Description
MFG CO.
'APW7077' PDF : 21 Pages View PDF
APW7077/A
Layout Considerations (Cont.)
MINIMUM RECOMMENDED FOOTPRINT FOR SUR-
FACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the
total design. The footprint for the semiconductor pack-
ages must be the correct size to insure proper solder
connection interface between the board and the
package. With the correct pad geometry, the pack-
ages will self align when subjected to a solder reflow
process.
Bottom Layer
Demo Board Circuit Layout
1600 mil
Top Layer
Copyright © ANPEC Electronics Corp.
17
Rev. A.4 - Sep, 2005
www.anpec.com.tw
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