AS5045
Data Sheet
14.1 Physical Placement of the Magnet
The best linearity can be achieved by placing the center of the magnet exactly over the defined center of the chip as
shown in the drawing below:
Figure 18. Defined Chip Center and Magnet Displacement Radius
3.9 mm
1
3.9 mm
lid 2.433 mm
ill va 2.433mm
Defined
center
Rd
Area of recommended maximum
magnet misalignment
AG t st Magnet Placement
s n The magnet’s center axis should be aligned within a displacement radius Rd of 0.25mm from the defined center of
e the IC.
m t The magnet may be placed below or above the device. The distance should be chosen such that the magnetic field
on the die surface is within the specified limits (see Figure 17). The typical distance “z” between the magnet and the
a n package surface is 0.5mm to 1.5mm, provided the use of the recommended magnet material and dimensions (6mm x
3mm). Larger distances are possible, as long as the required magnetic field strength stays within the defined limits.
o However, a magnetic field outside the specified range may still produce usable results, but the out-of-range condition
will be indicated by MagINCn (pin 1) and MagDECn (pin 2), see Table 1.
l c Figure 19. Vertical Placement of the Magnet
icaN
S
TechnDie surface
Package surface
z
0.576mm ± 0.1mm
1.282mm ± 0.15mm
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