AT24C08B-TH-B View Datasheet(PDF) - Atmel Corporation
Part Name
Description
MFG CO.
'AT24C08B-TH-B' PDF : 26 Pages View PDF
8U3-1 – dBGA2
E
D
1. b
PIN 1 BALL PAD CORNER
Top View
(d1)
PIN 1 BALL PAD CORNER
1
2
3
4
d
A1
A2
A
Side View
8
7
e
6
5
(e1)
Bottom View
8 SOLDER BALLS
1. Dimension “b” is measured at the maximum solder ball diameter.
This drawing is for general information only.
SYMBOL
A
A1
A2
b
D
E
e
e1
d
d1
COMMON DIMENSIONS
(Unit of Measure = mm)
MIN
0.71
0.10
0.40
0.20
NOM
0.81
0.15
0.45
0.25
1.50 BSC
2.00 BSC
0.50 BSC
0.25 REF
1.00 BSC
0.25 REF
MAX
0.91
0.20
0.50
0.30
NOTE
1150 E. Cheyenne Mtn. Blvd.
R Colorado Springs, CO 80906
TITLE
8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch,
Small Die Ball Grid Array Package (dBGA2)
6/24/03
DRAWING NO. REV.
PO8U3-1
A
24 AT24C04B/08B
5226D–SEEPR–7/08
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