AT24C128C View Datasheet(PDF) - Atmel Corporation
Part Name
Description
MFG CO.
'AT24C128C' PDF : 23 Pages View PDF
12.6 4U-9 — 4-ball WLCSP
A1 CORNER
TOP VIEW
12
k 0.015 (4X)
A
BOTTOM SIDE
2
1
A1 CORNER
A
A
E
e1
B
B
D
B
SIDE VIEW
A3
A2
A1
A
SEATING PLANE
C
k 0.075 C
PIN ASSIGNMENT MATRIX
1
2
A
VCC
SCL
B
SDA GND
db
d1
v
d0.015 m
d0.05 m C
C
A
B
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
A
A1
A2
MIN
0.260
0.080
0.160
TYP
0.295
0.095
0.175
MAX
0.330
0.110
0.190
NOTE
A3
0.025 REF
3
D
Contact Atmel for details
d1
0.400
E
Contact Atmel for details
e1
0.500
b
0.170 0.185 0.200
Note: 1. Dimensions are NOT to scale.
2. Solder ball composition is 95.5Sn-4.0Ag-0.5Cu.
3. Product offered with Back Side Coating (BSC)
Package Drawing Contact:
packagedrawings@atmel.com
TITLE
4U-9, 4-ball 2x2 Array, 0.40/0.50mm Pitch
Wafer Level Chip-Scale Package (WLCSP) with BSC
12/23/14
GPC DRAWING NO. REV.
GFC
4U-9
A
AT24C128C [DATASHEET] 21
Atmel-8734D-SEEPROM-AT24C128C-Datasheet_082015
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