AT24C128C-SSHM-T View Datasheet(PDF) - Atmel Corporation
Part Name
Description
MFG CO.
'AT24C128C-SSHM-T' PDF : 22 Pages View PDF
12.5 8U2-1 — 8-ball VFBGA
A1 BALL
PAD
CORNER
f 0.10 C
d 0.10 (4X)
D
A
E
d 0.08 C
C
Øb
j n0.15 m C A B
j n0.08 m C
e
A1 BALL PAD CORNER
21
A
B
C
D
(e1)
B
TOP VIEW
A1
A2
A
SIDE VIEW
d
(d1)
BOTTOM VIEW
8 SOLDER BALLS
Notes:
1. This drawing is for general
2. Dimension 'b' is measured at the maximum solder ball diameter.
3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu.
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
A
A1
A2
b
D
E
e
e1
d
d1
MIN NOM MAX
0.81 0.91 1.00
0.15 0.20 0.25
0.40 0.45 0.50
0.25 0.30 0.35
2.35 BSC
3.73 BSC
0.75 BSC
0.74 REF
0.75 BSC
0.80 REF
NOTE
Package Drawing Contact:
packagedrawings@atmel.com
TITLE
8U2-1, 8-ball, 2.35 x 3.73 mm Body, 0.75 mm pitch,
Very Thin, Fine-Pitch Ball Grid Array Package
(VFBGA)
6/11/13
GPC DRAWING NO. REV.
GWW
8U2-1
G
20 AT24C128C [DATASHEET]
Atmel-8734D-SEEPROM-AT24C128C-Datasheet_082015
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