AT24C256C View Datasheet(PDF) - Atmel Corporation
Part Name
Description
MFG CO.
'AT24C256C' PDF : 21 Pages View PDF
AT24C256C [Preliminary]
7. Ordering Information
7.1. Ordering Code Detail
AT24C256C-SS HL-B
Atmel Designator
Product Family
Device Density
256 = 256K
Device Revision
Shipping Carrier Option
B or blank = Bulk (tubes)
T = Tape and reel
Operating Voltage
L = 1.7V to 5.5V
Package Device Grade or
Wafer/Die Thickness
H = Green, NiPdAu lead finish,
Industrial Temperature Range
(-40°C to +85°C)
U = Green, matte Sn lead finish,
Industrial Temperature Range
(-40°C to +85°C)
11 = 11mil wafer thickness
Package Option
SS = JEDEC SOIC
X = TSSOP
MA = UDFN
W = wafer
WT = die in tape and reel
C = UFBGA
7.2.
AT24C256C Ordering Codes
Ordering Code
AT24C256C-SSHL-B(1)
AT24C256C-SSHL-T(2)
AT24C256C-XHL-B(1)
AT24C256C-XHL-T(2)
AT24C256C-MAHL-T(2)
AT24C256C-CUL-T(2)
AT24C256C-W11(3)
Voltage
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
1.7V to 5.5V
Package
8S1
8S1
8A2
8A2
8MA2
8U2-1
Die Sale
Operating Range
Lead-free/Halogen-free
Industrial Temperature (−40°C to 85°C)
Industrial Temperature (−40°C to 85°C)
Note:
1. “-B” denotes bulk.
2. “-T” denotes tape & reel. SOIC = 4K per reel. TSSOP, VFBGA and UDFN = 5K per reel.
3. Bumped die available upon request. Contact Atmel Marketing.
8S1
8A2
8MA2
8U2-1
Package Type
8-lead, 0.150” Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-lead, 4.40mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Dual No Lead Package (UDFN)
8-ball, die Ball Grid Array Package (VFBGA)
13
8568A–SEEPR–9/09
Share Link: 
