AT24C256C-PU View Datasheet(PDF) - Atmel Corporation
Part Name
Description
MFG CO.
'AT24C256C-PU' PDF : 23 Pages View PDF
AT24C256C
7. AT24C256C Ordering Codes
Ordering Code
AT24C256C-PU (Bulk Form Only)
AT24C256CN-SH-B(1) (NiPdAu Lead Finish)
AT24C256CN-SH-T(2) (NiPdAu Lead Finish)
AT24C256CW-SH-B(1) (NiPdAu Lead Finish)
AT24C256CW-SH-T(2) (NiPdAu Lead Finish)
AT24C256C-TH-B(1) (NiPdAu Lead Finish)
AT24C256C-TH-T(2) (NiPdAu Lead Finish)
AT24C256CY7-YH-T(2) (NiPdAu Lead Finish)
AT24C256CU2-UU-T(2)
AT24C256C-W-11
Voltage
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
Package
8P3
8S1
8S1
8S2
8S2
8A2
8A2
8Y7
8U2-1
Die Sale
Operating Range
Lead-free/Halogen-free
Industrial Temperature
(−40°C to 85°C)
Industrial Temperature
(−40°C to 85°C)
Note:
1. “-B” denotes bulk.
2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP and dBGA2 = 5K per reel. SAP = 3K per reel.
EIAJ = 2K per reel.
3. Available in tape & reel and wafer form; order as SL788 for inkless wafer form.
Bumped die available upon request. Contact Serial Interface Marketing.
8P3
8S1
8S2
8U2-1
8A2
8Y7
Ӎ1.8
Package Type
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-lead, 0.200” Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8-ball, die Ball Grid Array Package (dBGA2)
8-lead, 4.40 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 6.00 mm x 4.90 mm Body, Ultra Thin, Dual Footprint, Non-leaded, Small Array Package (SAP)
Options
Low-voltage (1.8V to 5.5V)
13
8568A–SEEPR–11/08
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