AT25128A-10PI-1.8 View Datasheet(PDF) - Atmel Corporation
Part Name
Description
MFG CO.
'AT25128A-10PI-1.8' PDF : 21 Pages View PDF
AT25256A Ordering Information(1)
Ordering Code
AT25256A-10PI-2.7
AT25256AN-10SI-2.7
AT25256AW-10SI-2.7
AT25256A-10TI-2.7
AT25256A-10PI-1.8
AT25256AN-10SI-1.8
AT25256AW-10SI-1.8
AT25256A-10TI-1.8
AT25256A-10PU-2.7(2)
AT25256A-10PU-1.8(2)
AT25256AN-10SU-2.7(2)
AT25256AN-10SU-1.8(2)
AT25256AW-10SU-2.7(2)
AT25256AW-10SU-1.8(2)
AT25256A-10TU-2.7(2)
AT25256A-10TU-1.8(2)
AT25256AU2-10UU-1.8(2)
AT25256AY4-10YU-1.8(2)
AT25256A-W2.7-11(3)
AT25256A-W1.8-11(3)
Package
8P3
8S1
8S2
8A2
8P3
8S1
8S2
8A2
8P3
8P3
8S1
8S1
8S2
8S2
8A2
8A2
8U2-1
8Y4
Die Sale
Die Sale
Operation Range
Industrial Temperature
(−40°C to 85°C)
Industrial Temperature
(−40°C to 85°C)
Lead-free/Halogen-free/
Industrial Temperature
(−40°C to 85°C)
Industrial Temperature
(−40°C to 85°C)
Notes:
1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC Characteristics
tables.
2. “U” designates Green package + RoHS compliant.
3. Available in waffle pack and wafer form; order as SL719 for wafer form. Bumped die available upon request. Please contact
Serial EEPROM Marketing.
8P3
8S1
8S2
8U2-1
8A2
8Y4
−2.7
−1.8
Package Type
8-lead, 0.300" Wide, Plastic Dual In-line Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8-lead, 0.200" Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8-ball, die Ball Grid Array Package (dBGA2)
8-lead, 4.4 mm Body, Thin Shrink Small Outline Package (TSSOP)
8-lead, 6.00 mm x 4.90 mm Body, Dual Footprint, Non-leaded, Small Array Package (SAP)
Options
Low-voltage (2.7V to 5.5V)
Low-voltage (1.8V to 5.5V)
14 AT25128A/256A
3368H–SEEPR–8/05
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