AT25P1024C1-10CI-2.7_06 View Datasheet(PDF) - Atmel Corporation
Part Name
Description
MFG CO.
'AT25P1024C1-10CI-2.7_06' PDF : 17 Pages View PDF
Packaging Information
8C1 – LAP
Marked Pin1 Indentifier
E
A
D
A1
Top View
Side View
0.10 mm
TYP
8
e
7
L1
1
2
6
3
5
4
e1
L
Bottom View
Pin1 Corner
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
A
0.94
1.04
1.14
A1
0.30
0.34
0.38
b
b
0.36
0.41
0.46
1
D
7.90
8.00
8.10
E
4.90
5.00
5.10
e
1.27 BSC
e1
0.60 REF
L
0.62 .0.67 0.72
1
L1
0.92
0.97
1.02
1
Note:
1. Metal Pad Dimensions.
2. All exposed metal area shall have the following finished platings.
Ni: 0.0005 to 0.015 mm
Au: 0.0005 to 0.001 mm
TITLE
1150 E.Cheyenne Mtn Blvd. 8CN1, 8-lead (8 x 5 x 1.04 mm Body), Lead Pitch 1.27 mm,
R Colorado Springs, CO 80906 Leadless Array Package (LAP)
11/8/04
DRAWING NO. REV.
8CN1
B
14 AT25P1024
1082I–SEEPR–7/06
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