AT45DB View Datasheet(PDF) - Atmel Corporation
Part Name
Description
MFG CO.
'AT45DB' PDF : 18 Pages View PDF
Packaging Information
32J, 32-Lead, Plastic J-Leaded Chip Carrier (PLCC)
Dimensions in Inches and (Millimeters)
JEDEC STANDARD MS-016 AE
28R, 28-Lead, 0.330" Wide, Plastic Gull Wing Small
Outline (SOIC)
Dimensions in Inches and (Millimeters)
.045(1.14) X 45° PIN NO. 1
IDENTIFY
.025(.635) X 30° - 45°
.012(.305)
.008(.203)
.032(.813)
.026(.660)
.553(14.0)
.547(13.9)
.595(15.1)
.585(14.9)
.530(13.5)
.490(12.4)
.021(.533)
.013(.330)
.050(1.27) TYP
.300(7.62) REF
.430(10.9)
.390(9.90)
AT CONTACT
POINTS
.030(.762)
.015(3.81)
.095(2.41)
.060(1.52)
.140(3.56)
.120(3.05)
.453(11.5)
.447(11.4)
.495(12.6)
.485(12.3)
.022(.559) X 45° MAX (3X)
28T, 28-Lead, Plastic Thin Small Outline Package
(TSOP)
Dimensions in Millimeters and (Inches)*
24C1, 24-Ball (5 x 5 array) 1.0mm Pitch 8 x 6 mm
Plastic Chip-scale Ball Grid Array (CBGA)
Dimensions in Millimeters and (Inches)
6.2 (0.244)
5.8 (0.228 )
8.2 (0.323)
7.8 (0.307)
*Controlling dimension: millimeters
18
AT45DB041
1.12 (0.044)
0.86 (0.034)
1.40 (0.055) MAX
4.0 (0.157)
54 3 21
2.12 (0.083)
1.86 (0.073)
0.30 (0.012)
A
B
C
4.0 (0.157)
D
E
1.00 (0.039) BSC
NON-ACCUMULATIVE
0.46 (0.018)
DIA BALL TYP
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