AT45DB081B-CU View Datasheet(PDF) - Atmel Corporation
Part Name
Description
MFG CO.
'AT45DB081B-CU' PDF : 33 Pages View PDF
Ordering Information
fSCK
(MHz)
20
ICC (mA)
Active Standby
10
0.01
20
10
0.01
15
10
0.01
Ordering Code
AT45DB081B-CC
AT45DB081B-CNC
AT45DB081B-RC
AT45DB081B-TC
AT45DB081B-CI
AT45DB081B-CNI
AT45DB081B-RI
AT45DB081B-TI
AT45DB081B-CC-2.5
AT45DB081B-CNC-2.5
AT45DB081B-RC-2.5
AT45DB081B-TC-2.5
Green Packaging Options (Pb/Halide-free)
fSCK
(MHz)
ICC (mA)
Active Standby
Ordering Code
AT45DB081B-CNU
AT45DB081B-RU
20
10
0.01
AT45DB081B-TU
AT45DB081B-CU
Note: Green packages cover lead-free requirements.
Package
14C1
8CN3
28R
28T
14C1
8CN3
28R
28T
14C1
8CN3
28R
28T
Operation Range
Commercial
(0° C to 70° C)
Industrial
(-40° C to 85° C)
Commercial
(0° C to 70° C)
2.5V to 3.6V
Package
8CN3
28R
28T
14C1
Operation Range
Industrial
(-40° C to 85° C)
14C1
8CN3
28R
28T
Package Type
14-ball (3 x 5 Array), Plastic Chip-scale Ball Grid Array (CBGA)
8-pad (6 mm x 8 mm ) Chip Array Small Outline No Lead Package (CASON)
28-lead, 0.330" Wide, Plastic Gull Wing Small Outline Package (SOIC)
28-lead, Plastic Thin Small Outline Package (TSOP)
28 AT45DB081B
2225J–DFLSH–2/08
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