Packaging Information
32T, 32-lead, Plastic Thin Small Outline Package
(TSOP)
Dimensions in Millimeters and (Inches)*
JEDEC OUTLINE MO-142 BD
INDEX
MARK
18.5(.728) 20.2(.795)
18.3(.720) 19.8(.780)
0.50(.020)
BSC
7.50(.295)
REF
8.20(.323)
7.80(.307)
0.25(.010)
0.15(.006)
1.20(.047) MAX
0
5
REF
0.15(.006)
0.05(.002)
0.70(.028)
0.50(.020)
*Controlling dimension: millimeters
0.20(.008)
0.10(.004)
44C1, 44-ball (5 x 9 Array), 1.0 mm Pitch,
Plastic Chip-scale Ball Grid Array (CBGA)
Dimensions in Millimeters and (Inches)*
6.2 (0.244)
5.8 (0.228)
12.2 (0.480)
11.8 (0.465)
1.12 (0.044)
0.88 (0.035)
54 3 21
4.0 (0.157)
0.30 (0.012)
1.20 (0.047) MAX
2.12 (0.083)
1.88 (0.074)
A
B
C
D
E
8.0 (0.315)
F
G
H
J
0.41 (0.016)
1.00 (0.039) BSC
DIA BALL TYP
NON-ACCUMULATIVE
*Controlling dimension: millimeters
20
AT45DB321