AT88SA10HS View Datasheet(PDF) - Atmel Corporation
Part Name
Description
MFG CO.
'AT88SA10HS' PDF : 25 Pages View PDF
8X –TSSOP
C
1
Pin 1 indicator
this corner
E1
E
L1
N
Top View
A
b
L
End View
A1
e
A2
D
Notes:
Side View
1. This drawing is for general information oy.nl Refer to
JEDEC Drawing MO-153, VariationAA, for proper
dimensions, tolerances, datums, etc.
2. Dimension D does not include mold Flash, protrusions or
gate burrs. Mold Flash, protrusions and gate burrs shall not
exceed 0.15mm (0.006in) per side.
3. Dimension E1 does not include inter-lead Flash or
protrusions. Inter-lead Flash and protrusions shall not exceed
0.25mm (0.010in) per side.
4. Dimension b does not include Dambar protrusion.
Allowable Dambar protrusion shall be 0.08 mm total in excess
of the b dimension at maximum material condition. Dambar
cannot be located on the lower radius of the foot. Minimum
space between protrusion and adjacent lead is 0.07mm.
5. Dimension D and E1 to be determined at Datum Plane H.
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
A
A1
A2
D
E
E1
b
e
L
L1
C
MIN
-
0.05
0.80
2.90
4.30
0.19
0.45
NOM MAX NOTE
-
1.20
-
0.15
1.00 1.05
3.00 3.10 2, 5
6.40 BSC
4.40 4.50 3, 5
–
0.30
4
0.65 BSC
0.60 0.75
1.00 REF
0.09
-
0.20
TITLE
Package Drawing Contact: 8X, 8-lead 4.4mm Body, Plastic Thin
packagedrawings@atmel.com Shrink Small Outline Package (TSSOP)
GPC
6/22/11
DRAWING NO. REV.
TNR
8X
D
Atmel AT88SA10HS [DATASHEET] 22
8595G−CRYPTO−9/11
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